MATERIAL:
HOUSING: LCP WITH 30% G.F ,UL94V-0, BLACK.
CONTACT: BARSS, C2680-H
BOARDLOCK: BRASS, C2680-H
FINSH:
CONTACT: GOLD PLATED ON CONTACT AREA 100u" MIN.SN ONLY (MATTE) PLATED ON SOLDERING END OVER 30u" MIN. NICKEL END OVER 30u" MIN. NICKEL BOARDLOCK: 100u" MIN. SN ONLY (MATTE) PLATING OVER 30u" MIN. NI UNDER-PLATING
SATA 7+15P R/A FEMALE DIP TYPE
MATERIAL:
Housing: LCP with 30% G.F, UL94V-0
Contact: Phosphor Bronze
Boardlock: Brass
POST: Brass
FINISH:
Contact: Gold plated on contact area & 100u" Min. Sn only (MATTE) plated on soldering end over 30u" Min. Nickel under-plating.
Boardlock: 100u" Min. Sn only (MATTE) Plating over 30u" Min. Ni underplating
Post: 100u" Min. Sn only (MATTE) Plating over 30u" Nickel under-plating
SPECIFICATIONS:
OPERATING TEMPERATURE: -55° TO +105°
CURRENT RATING: 1.5Amps MAX. PER PIN.
SATA 7+15P R/A SMT TYPE
MATERIAL:
HOUSING: LCP WITH 30% G.F, UL94V-0. BLACK
BOARDLOCK: BRASS, C2680-H
FINSH:
CONTACT: GOLD PLATED ON CONTACT AREA 100u" MIN.
SN ONLY (MATTE) PLATED ON SOLDERING END
OVER 30u" MIN. NICKEL UNDER-PLATING.
BOARDLOCK:100u:" MIN. SN ONLY (MATTE) PLATING OVER
30u" MIN. NI UNDERPLATING
SATA 7+15P 3 IN 1
1. MATERIAL:
HOUSING: LCP+30% G.F, UL94V-0, COLOR: BLACK
CONTACT PINS: BRASS
2. PLATING:
CONTACT: 0.127UM MIN. AU FLASH OVER 1.27UM MIN. NI UNDERPLATE
SOLDERTAIL: 3.18UM MIN. (90/10) SN ONLY OVER 1.27UM NI UNDERPLATE
3. VENDOR LOGO, LOCATED APPROXIMATELY AS SHOWN
DATE CODE TO BE LASER PRINTED, CHARACTER HEIGHT IS 3.00MM
4. MAX. WARPAGE OF 0.13MM OVER LENGTH OF CONNECTOR IN ANY DIRECTION,
BEFORE AND AFTER EXPOSURE TO 225°C FOR 1 MIN.
235°C FOR 15 SEC. AND 245°C FOR 10 SEC.
5. DATUM A IS DEFINED AS THE TOP PORTION OF THE NOTED BLADE SURFACE.
6. DATUM B IS DEFINED AS THE CENTERLINE OF THE 33.39 DIMENSION.
FLASH SHALL NOT COVER ANY PORTION OF THE MATING SURFACE AND
SHALL NOT EXCEED 0.15MM MAX. AT NON-CRTICAL OR FUNCTIONAL AREA.
8. THE RETENTION FORCE SHALL BE 0.6KG MIN/PIN.
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