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USB + eSATA |
- NOTES:
1.MATERIAL:
1.1 HOUSING: HIGH TEMPERATURE THERMOPLASTIC GLASS FILLED, UL94v-0,
COLOR BLACK.
1.2 CONTACTS-1: COPPER ALLOY.
1.3 CONTACTS-1: COPPER ALLOY.
1.4 SHELL: COPPER ALLOY.
1.5 PROTECT: HIGH TEMPERATURE THERMOPLASTIC
GLASS FILLED, UL94V-0, COLOR BLACK.
2.PLATING:
2.1 CONTACTS:
GOLD PLATED IN CONTACT AREA, MATTE-TIN
2.54um(100μ") MIN. IN SOLDERING ZONE ON
UNDERPLATED 1.27um(50μ" ) MIN. NICKEL OVER
ALL.
2.2 SHELL:
MATTE-TIN 120μ" MIN. OVER UNDERPLATED 1.27GM
(50G") NICKEL OVER ALL.
3.RoHS COMPLIANT PRODUCTS
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USB 3.0 USB AF |
- NOTES:
1.MATERIAL:
1.1 INSULATOR: HIGH TEMPERATURE PLASTIC UL 94-VO
1.2 CONTACT: C5210 (T=0.20mm)
1.3 SHELL: SPCC (T=0.30mm)
2.ELECTRICAL CHARACTERISTICS;
2.1 CONTACT RESISTANCE: 30mΩ MAXIMUM
2.2 CONTACT CURRENT RATING: 1.5AMPERES
2.3 DIELECTRIC WITHSTANDING VOLTAGE: 500 V R. M. S.
2.4 INSULATION RESISTANCE 1000 MEGOHMS MIN
2.5 OPERATING TEMPERATURE: -40℃ ~ 85℃
3.MECHANICAL CHARACTERISTICS:
3.1 MATING FORCE: 3.57kg MAX
3.2 UNMATING FORCE: 1.02kg MIN
3.3 DURABILITY: MANDATORY: 5,000 CYCLES
4.PLATING
4.1 TERMINAL: GOLD FLASH ALL OVER 50u" MIN NICKEL
AND 80u"MIN Tin ALL OVER 50u" MIN ON SOLDER AREA
4.2 SHELL: 80u"MIN. NICEL OVER 20"MIN COPPER
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USB 3.0 AM DIP |
- NOTES:
1.MATERIAL:
1.1 INSULATOR: HIGH TEMPERATURE PLASTIC UL 94-VO
1.2 CONTACT: C5210 (T=0.20mm)
1.3 SHELL: SPCC (T=0.30mm)
2.ELECTRICAL CHARACTERISTICS;
2.1 CONTACT RESISTANCE: 30mΩ MAXIMUM
2.2 CONTACT CURRENT RATING: 1.5AMPERES
2.3 DIELECTRIC WITHSTANDING VOLTAGE: 500 V R. M. S.
2.4 INSULATION RESISTANCE 1000 MEGOHMS MIN
2.5 OPERATING TEMPERATURE: -40℃ ~ 85℃
3.MECHANICAL CHARACTERISTICS:
3.1 MATING FORCE: 3.57kg MAX
3.2 UNMATING FORCE: 1.02kg MIN
3.3 DURABILITY: MANDATORY: 5,000 CYCLES
4.PLATING
4.1 TERMINAL: GOLD FLASH ALL OVER 50u" MIN NICKEL
AND 80u"MIN Tin ALL OVER 50u" MIN ON SOLDER AREA
4.2 SHELL: 80u"MIN. NICEL OVER 20"MIN COPPER
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USB 3.0 AF DIP |
- NOTES:
Specification:
1. Rates voltage and current: 1A Max.
2. Dielectric withstanding voltage: 30V(ac) for 1 minute.
3. Contact resistance: Before life test 30m ohm Max.
After life test 50m ohm max
4. Insulation resistance: 1000M ohm Min at DC 500V.
5. Insertion force: 35 Newtons Max.
6. Extraction force: 10 Newtons Min.
7. Solderability: Terminal shall be immersed in flux before text,
Then dip in molten solder for 5±0.5 sec. At 245±5℃
8. Temperature range: -55℃ ~ +85℃
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USB 3.0 AF REVERSE DIP
TYPE |
- NOTES:
1.MATERIAL:
1.1 INSULATOR: HIGH TEMPERATURE PLASTIC UL 94-VO
1.2 CONTACT: C5210 (T=0.20mm)
1.3 SHELL: BRASS (T=0.30mm)
2.ELECTRICAL CHARACTERISTICS;
2.1 CONTACT RESISTANCE: 30mΩ MAXIMUM
2.2 CONTACT CURRENT RATING: 1.5A
2.3 DIELECTRIC WITHSTANDING VOLTAGE: 500 V R. M. S.
2.4 INSULATION RESISTANCE 1000 MEGOHMS MIN
2.5 OPERATING TEMPERATURE: -40℃ ~ 85℃
3.MECHANICAL CHARACTERISTICS:
3.1 MATING FORCE: 3.57kg MAX
3.2 UNMATED FORCE: 1.02kg MIN
3.3 DURABILITY: MANDATORY: 5,000 CYCLES
4.PLATING
4.1 TERMINAL CONTACT: 30u" GOLD FLASH ALL OVER 50u"
MIN NICKEL AND 80u"MIN Tin ALL OVER 50u" MIN ON
SOLDER AREA
4.2 SHELL: 80u"MIN. NICEL OVER 20"MIN COPPER
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USB 3.0 BF DIP |
- NOTES:
1.MATERIAL:
1.1 INSULATOR: HIGH TEMPERATURE PLASTIC UL 94-VO
1.2 CONTACT: C5210 (T=0.20mm)
1.3 SHELL: BRASS (T=0.30mm)
2.ELECTRICAL CHARACTERISTICS;
2.1 CONTACT RESISTANCE: 30mΩ MAXIMUM
2.2 CONTACT CURRENT RATING: 1.5A
2.3 DIELECTRIC WITHSTANDING VOLTAGE: 500 V R. M. S.
2.4 INSULATION RESISTANCE 1000 MEGOHMS MIN
2.5 OPERATING TEMPERATURE: -40℃ ~ 85℃
3.MECHANICAL CHARACTERISTICS:
3.1 MATING FORCE: 3.57kg MAX
3.2 UNMATED FORCE: 1.02kg MIN
3.3 DURABILITY: MANDATORY: 5,000 CYCLES
4.PLATING
4.1 TERMINAL CONTACT: 15u" GOLD FLASH ALL OVER 50u"
MIN NICKEL AND 80u"MIN Tin ALL OVER 50u" MIN ON
SOLDER AREA
4.2 SHELL: 80u"MIN. NICEL OVER 20"MIN COPPER
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MICRO USB 3.0 BF SMT |
- NOTES:
1.MATERIAL:
1.1 INSULATOR: HIGH TEMPERATURE PLASTIC UL94 V-O
1.2 CONTACT: COPPER ALLOY (T=0.20mm)
1.3 SHELL: BRASS (T=0.30mm)
2.ELECTRICAL CHARACTERISTICS;
2.1 CONTACT RESISTANCE: 30mΩ MAXIMUM
2.2 CONTACT CURRENT RATING: 1.5A
2.3 DIELECTRIC WITHSTANDING VOLTAGE: 500 V R. M. S.
2.4 INSULATION RESISTANCE 1000 MΩ Min
2.5 OPERATING TEMPERATURE: -40℃ ~ 85℃
3.MECHANICAL CHARACTERISTICS:
3.1 MATING FORCE: 35 N Max
3.2 UNMATED FORCE: 10 N Min FOR INITIAL; 8 N Min AFTER
LIFE TEST.
3.3 DURABILITY: MANDATORY: 5,000 CYCLES
4.PLATING
4.1 TERMINAL CONTACT: (Min) 0.05μm Au + (Min) 0.75μm
Ni-Pd ALL OVER 50u" Min NICKEL AND 80u"MIN Tin ALL
OVER 50u" Min NICKEL ON SOLDER AREA
4.2 SHELL: 80u"MIN. NICEL OVER 20"MIN COPPER
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