| CPU SOCKET FOR 775
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- MATERIAL:
HOUSING: LCP WITH 30% G/F,UL94V-0,BLACK
CONTACT: COPPER ALLOY.
SOLDER BALL: Sn9605 AG3 Cu0.5 Φ0.65
STIFFENER PLATE: STAINLESS STELL.
LOAD PLATE: STAINLESS STELL.
LEVER: STAINLESS STELL.
CAP: LCP WITH 30% G/F,UL94V-0,BLACK
FINISH:
CONTACT: GOLD PLATING OVER 50μ" Min. NICKEL UNDER PLATED.
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| CPU SOCKET DIP FOR 478.479
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- MATERIAL:
Housing: LCP with glass filled UL94V-0
Cover: LCP with glass filled UL94V-0
Contact: Phosphor bronze
Handle: SUS
FINISH:
Contact: Gold plated on contact area & 100μ"min. Sn only (MATTE) plated on soldering end over 50μ" min. nickel under-plating.
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| CPU SOCKET SMT FOR 478.479
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- MATERIAL AND FINISH:
Cover: LCP with glass fiber UL94V-0
Base: LCP with glass fiber UL94V-0,
Latch: SUS
Contact: Phosphor bronze
Plating: Gold plated on contact area &Sn only (MATTE) 100μ" Plated over ni 50 under-plating
Operating temperature: -55oC to +105oC
Ratings:
Voltage rating : 50 VAC.
Current rating: 0.5A.
Mechanical:
Durability: 20 cycles min.
Electrical:
Insulation resistance: 500MΩ min.
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| CPU SOCKET FOR 939.940 |
- Material and Finish:
Cover: LCP With 30% Glass Fiber UL 94V-0, Color: Ivory
Basse: LCP With 30% Glass Fiber UL 94V-0, Color: Black
Latch: SUS 304 HQ
Contact: Phosphor Bronze C5191R-H
Plating: Gold plated on contact area Ni 50u" Under-Plating
Operating Temperature: -55℃ to +105℃
Ratings:Voltage Rating: 50 VAC.
Current Rating: 0.5A.
Mechanical:
Durability: 20 Cycles min.
Electrical:
Insulation Resistance: 500MΩ min.
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